Semiconductor Cleanroom Wipe Practices

Cleaning wipes are critical in semiconductor cleanrooms to maintain particle-free and ESD-safe environments. Proper techniques ensure effective contamination control and protect sensitive semiconductor components.

Key Features:

  • Lint-Free: Prevents fiber shedding that could damage wafers or devices.

  • High Absorbency: Quickly removes residues, oils, and moisture.

  • Antistatic Properties: Reduces electrostatic discharge (ESD) risks.

  • Durable: Resists tearing for thorough cleaning of critical areas.

Usage Techniques:

  1. Unidirectional Wiping: Always wipe in one direction to avoid redepositing particles.

  2. Single-Use: Dispose of each wipe after use to prevent cross-contamination.

  3. Target High-Risk Areas: Focus on benches, tools, and sensitive equipment first.

  4. Pre-Wetted Wipes: Use IPA or deionized water pre-moistened wipes for enhanced cleaning.

Application Range:

  • Semiconductor Wafers: Cleaning surfaces before and after processing.

  • Workstations: Maintaining particle-free benches and tool areas.

  • Optical Components: Lenses and mirrors in semiconductor inspection equipment.

  • Cleanroom Compliance: Supports Class 100–1000 standards for sensitive environments.

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